Model 200 Dimpling Grinder Dimpling Rates

Material

Average Compressive
Strength (MPA)

Form Tested

Dimpling Rate,
Diamond Abrasive
(µm/min)

SiC

6000

Dense wafer

Stabilized ZrO2

3350

Sintered body

0.7 to 2.5*

Si

2800

Dense wafer

2.4 to 7.5*

Stainless steel

300

Foil

2.1

 

 

 

 

 

 

 

 

 

 

*Parameters: 9 µm diamond abrasive with Micarta grinding wheel, weight = 30 g.
†Parameters: 6 µm diamond abrasive with Micarta grinding wheel, weight = 30 g.