Model
170 Ultrasonic Disk Cutter
Cut TEM specimens from hard, brittle materials without mechanical
or thermal damage. Unique design means that the sample is
always presented parallel to the cutting axis. Process is
automatically terminated once the specimen has been cut.
Optional microscope enables site-specific cutting. Highly
effective for cutting disk, cylindrical, or rectangular
specimens.
Model 180
XTEM Preparation Kit
The Model 180 XTEM Prep Kit is designed to produce controlled
cross-section TEM (XTEM) specimens. Widely used cross-section
samples include semiconductor devices which often have multiple
layers and thus multiple interfaces, specimens with thin film
layers, and composite materials.
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