Journal articles

Fischione products play an instrumental role in cutting-edge electron microscopy research. Below you will find journal articles in which Fischione products were used to achieve the published results.

 
Keywords Title/Link Citation

Model 110 Automatic Twin-Jet Electropolisher

EBSD, creep voids, 3D, hydrogen reformer tubes 3D analysis of creep voids in hydrogen reformer tubes Wahab, A. A., & Kral, M. V. (2005). 3D analysis of creep voids in hydrogen reformer tubes. Materials Science and Engineering: A, 412, 222–229.

Model 160 Specimen Grinder

Surface topography, surface roughness metrics, transmission electron microscopy (TEM), TEM sample preparation, Hurst exponent and fractal dimension, power spectral density (PSD), root-mean-square (RMS) slope Characterization of small-scale surface topography using transmission electron microscopy Khanal, S. R., Gujrati, A., Vishnubhotla, S. B., Nowakowski, P., Bonifacio, C. S., Pastewka, L., and Jacobs, T. D. (2018). Characterization of small-scale surface topography using transmission electron microscopy. Surface Topography: Metrology and Properties, 6(4), 045004.

Model 170 Ultrasonic Disk Cutter

Surface topography, surface roughness metrics, transmission electron microscopy (TEM), TEM sample preparation, Hurst exponent and fractal dimension, power spectral density (PSD), root-mean-square (RMS) slope Characterization of small-scale surface topography using transmission electron microscopy Khanal, S. R., Gujrati, A., Vishnubhotla, S. B., Nowakowski, P., Bonifacio, C. S., Pastewka, L., and Jacobs, T. D. (2018). Characterization of small-scale surface topography using transmission electron microscopy. Surface Topography: Metrology and Properties, 6(4), 045004.

Model 200 Dimpling Grinder

Surface topography, surface roughness metrics, transmission electron microscopy (TEM), TEM sample preparation, Hurst exponent and fractal dimension, power spectral density (PSD), root-mean-square (RMS) slope Characterization of small-scale surface topography using transmission electron microscopy Khanal, S. R., Gujrati, A., Vishnubhotla, S. B., Nowakowski, P., Bonifacio, C. S., Pastewka, L., and Jacobs, T. D. (2018). Characterization of small-scale surface topography using transmission electron microscopy. Surface Topography: Metrology and Properties, 6(4), 045004.

Model 1020 Plasma Cleaner

Plasma cleaning, EELS, EDS Plasma cleaning and its applications for electron microscopy Isabell, T. C., Fischione, P. E., O'Keefe, C., Guruz, M. U., & Dravid, V. P. (1999). Plasma cleaning and Its applications for electron microscopy. Microscopy and Microanalysis, 5(2), 126-135.
Plasma cleaning, carbonaceous contamination, shield, TEM, carbon hydroxide, holey carbon films, EELS, HREM Plasma cleaning of carbonaceous samples using a shield Willems, B., Hamon, A., Schryvers, D., Robins, A., Matesa, J., & Fischione, P. (2003). Plasma cleaning of carbonaceous samples using a shield. Microscopy and Microanalysis, 9, 164-165.
Semiconductor, plasma cleaning, carbonaceous contamination, TEM, SEM, SEM holders Applications of plasma cleaning for electron microscopy of semiconducting materials Isabell, T. C., & Fischione, P. E. (1998). Applications of Plasma Cleaning for Electron Microscopy of Semiconducting Materials. MRS Proceedings.
Plasma cleaning, cryo-EM, blotting, TEM, holey carbon films Improving automation for cryo-EM specimen preparation Quispe, J., Banez, R., Carragher, B., & Potter, C. S. (2004). Improving Automation for Cryo-EM Specimen Preparation. Microscopy and Microanalysis
Plasma cleaning, carbon contamination, STEM Quantification of carbon contamination under electron beam irradiation in a scanning transmission electron microscope and its suppression by plasma cleaning Griffiths, A. J., & Walther, T. (2010). Quantification of carbon contamination under electron beam irradiation in a scanning transmission electron microscope and its suppression by plasma cleaning. Journal of Physics: Conference Series.

Model 1040 NanoMill® TEM Specimen Preparation System

Foreign-object damage, high-cycle fatigue, fatigue-crack growth threshold, small cracks, Ti–6Al–4V Influence of foreign-object damage on crack initiation and early crack growth during high-cycle fatigue of Ti-6Al-4V Peters, J. O., & Ritchie, R. O. (2000). Influence of foreign-object damage on crack initiation and early crack growth during high-cycle fatigue of Ti-6Al-4V. Engineering Fracture Mechanics, 67, 193-207.
FIB, TEM, low-energy argon beam, semiconductor Post-FIB TEM sample preparation using a low energy argon beam  Genç, A., Basile, D. P., Viswanathan, G. B., Fraser, H. L., & Fischione, P. E. (2007). Post-FIB TEM sample preparation using a low energy argon beam. Microscopy and Microanalysis, 13, 1520-1521.
Aberration correction, STEM, APT, order-disorder interfaces Atomic scale structure and chemical composition across order-disorder interfaces
Srinivasan, R., Banerjee, R., Hwang, J. Y., Viswanathan, G. B., Tiley, J., Dimiduk, D. M., & Fraser, H. L. (2009). Atomic scale structure and chemical composition across order-disorder interfaces. Physical Review Letters, 102(8), 086101 (1-4).
TEM, STEM, FIB, aberration correction Raising the standard of specimen preparation for aberration-corrected TEM and STEM Cerchiara, R. R., Fischione, P. E., Liu, J., Matesa, J. M., Robins, A. C., Fraser, H. L., & Genç, A. (2011). Raising the standard of specimen preparation for aberration-corrected TEM and STEM. Microscopy Today, 19(1), 16-19.
Argon ion milling, ultrathin specimen Ultrathin specimen preparation by a low-energy Ar-ion milling method Mitome, M. (2012). Ultrathin specimen preparation by a low-energy Ar-ion milling method. Microscopy, 62(2), 321-326.
TEM, FIB, damaging, lamella, front view Sample preparation by focused ion beam micromachining for transmission electron microscopy imaging in front-view Jublot, M., & Texier, M. (2013). Sample preparation by focused ion beam micromachining for transmission electron microscopy imaging in front-view. Micron, 56, 63-67.
Abberation correction TEM, boron carbide Atomic structure of amorphous shear bands in boron carbide Reddy, K. M., Liu, P., Hirata, A., Fujita, T., & Chen, M. W. (2013). Atomic structure of amorphous shear bands in boron carbide. Nature Communications, 4.
FIB, TEM specimen preparation, sample thickness, backscattered electrons, EDX, Monte Carlo simulations, sub-kV argon milling Practical aspects of the use of the X2 holder for HRTEM-quality TEM sample preparation by FIB Van Mierlo, W., Geiger, D., Robins, A., Stumpf, M., Ray, M. L., Fischione, P., & Kaiser, Y. (2014). Practical aspects of the use of the X2 holder for HRTEM-quality TEM sample preparation by FIB. Ultramicroscopy, 147, 149-155. 
Superalloys, nanotwinning, phase transformation Phase transformation strengthening of high-temperature superalloys Smith, T. M., Esser, B. D., Antolin, N., Carlsson, A., Williams, R. E., Wessman, A., Hanlon, T., Fraser, H.L., Windl, W., McComb, D.W., & Mills, M.J. (2016). Phase transformation strengthening of high-temperature superalloys. Nature Communications, 7, 13434. 
Ion milling, focused ion beam, amorphous damage, implantation, artifact A small spot, inert gas,ion milling process as a complementary technique to focused ion beam specimen preparation Fischione, P. E., Williams, R. E., Genç, A., Fraser, H. L., Dunin-Borkowski, R. E., Luysberg, M., Bonifacio, C., & Kovács, A. (2017). A small spot, inert gas, ion milling process as a complementary technique to focused ion beam specimen preparation. Microscopy and Microanalysis, 23(4), 782-793.
TEM specimen preparation, focused low-energy ion milling, thin films, interfaces, GaN, phase change materials Focused high- and low-energy ion milling for TEM specimen preparation Lotnyk, A., Poppitz, D., Ross, U., Gerlach, J., Frost, F., Bernütz, S., … Rauschenbach, B. (2015). Focused high- and low-energy ion milling for TEM specimen preparation. Microelectronics Reliability, 55(9-10), 2119-2125.
Transmission Kikuchi diffraction focused ion beam tomography, titanium dioxide nanoparticles, porosity, particle size, dye sensitized solar cells Characterization of the inner structure of porous TiO2 nanoparticle films in dye sensitive solar cells (DSSC) by focused ion beam (FIB) tomography and transmission Kikuchi diffraction (TKD) in the scanning electron microscope (SEM) Wollschläger, N., Palasse, L., Häusler, I., Dirscherl, K., Oswald, F., Narbey, S., … Hodoroaba, V. (2017). Characterization of the inner structure of porous TiO2 nanoparticle films in dye sensitive solar cells (DSSC) by focused ion beam (FIB) tomography and transmission Kikuchi diffraction (TKD) in the scanning electron microscope (SEM). Materials Characterization, 131, 39-48.
Al-Zn-Mg-Cu (AA7050) aluminium alloy, η-type precipitates, layer-by-layer growth, η4' and η12 precipitates An atomic scale structural investigation of nanometre-sized ƞ precipitates in the 7050 aluminium alloy Chung, T., Yang, Y., Shiojiri, M., Hsiao, C., Li, W., Tsao, C., … Yang, J. (2019). An atomic scale structural investigation of nanometre-sized η precipitates in the 7050 aluminium alloy. Acta Materialia, 174, 351-368.
Mixed gas, chromia sulfidation, carburization, water vapor Use of microanalysis to better understand the high‑temperature corrosion behavior of chromium exposed to multi‑oxidant environments Soltanattar, S., Nowakowski, P., Bonifacio, C. S., Fischione, P., and Gleeson, B. (2018). Use of microanalysis to better understand the high-temperature corrosion behavior of chromium exposed to multi-oxidant environments. Oxidation of Metals, 91(1-2), 11-31. 

Model 1051 TEM Mill

Thermoelectric, diamond-like compound, Cu2SnSe3, phase coexistence

Investigations on electrical and thermal transport properties of Cu2SnSe3 with unusual coexisting nanophases Zhou, Y., Wu, H., Wang, D., Fu, L., Zhang, Y., He, J., Pennycook, S.J.,&  Zhao, L. (2018). Investigations on electrical and thermal transport properties of Cu2SnSe3 with unusual coexisting nanophases. Materials Today Physics, 7, 77-88.
Synergistic compositional-mechanical-thermal effects, high zT, n-type V2VI3 alloys, hot deformation Synergistic compositional–mechanical–thermal effects leading to a record high zT in n-type V2VI3 alloys through progressive hot deformation Hu, L., Zhang, Y., Wu, H., Liu, Y., Li, J., He, J., Ao, W., Liu, F., Pennycook, S.J., and Zeng, X. (2018). Synergistic compositional-mechanical-thermal effects leading to a record high zT in n-type V2VI3 alloys through progressive hot deformation. Advanced Functional Materials, 28(35), 1803617. 
KNN-based ceramics, lead-based piezoelectric materials; high piezoelectricity, potassium-sodium niobate, lead free ceramics The structural origin of enhanced piezoelectric performance and stability in lead free ceramics Zheng, T., Wu, H., Yuan, Y., Lv, X., Li, Q., Men, T., Zhao, C., Xiao, D., Wu, J., Wang, K., Li, J.F., Gu, Y., Zhu, J., & Pennycook, S. J. (2017). The structural origin of enhanced piezoelectric performance and stability in lead free ceramics. Energy & Environmental Science, 10(2), 528-537.
High entropy alloys, SnTe, thermoelectric materials, entropy engineering Entropy engineering of SnTe: multi-principal-element alloying leading to ultralow lattice thermal conductivity and state-of-the-art thermoelectric performance Hu, L., Zhang, Y., Wu, H., Li, J., Li, Y., Mckenna, M., He, J., Liu, F., Pennycook, S.J., and Zeng, X. (2018). Entropy engineering of SnTe: Multi-principal-element alloying leading to ultralow lattice thermal conductivity and state-of-the-art thermoelectric performance. Advanced Energy Materials, 8(29), 1802116.
Intrinsically low thermal conductivity, BiSbSe3, thermoelectric material, conduction bands Intrinsically low thermal conductivity in BiSbSe3: A promising thermoelectric material with multiple conduction bands Liu, X., Wang, D., Wu, H., Wang, J., Zhang, Y., Wang, G., Pennycook, S.J., and Zhao, L. (2018). Intrinsically low thermal conductivity in BiSbSe3: A promising thermoelectric material with multiple conduction bands. Advanced Functional Materials, 29(3), 1806558.
Surface topography, surface roughness metrics, transmission electron microscopy (TEM), TEM sample preparation, Hurst exponent and fractal dimension, power spectral density (PSD), root-mean-square (RMS) slope Characterization of small-scale surface topography using transmission electron microscopy Khanal, S. R., Gujrati, A., Vishnubhotla, S. B., Nowakowski, P., Bonifacio, C. S., Pastewka, L., and Jacobs, T. D. (2018). Characterization of small-scale surface topography using transmission electron microscopy. Surface Topography: Metrology and Properties, 6(4), 045004.

Model 1061 SEM Mill

Delayering, cross-section samples, broad ion beam milling Advanced tools and techniques for delayering and cross-sectioning semiconductor devices Nowakowski, P., Ray, M. L., and Fischione, P. E. (2017). Advanced tools and techniques for delayering and cross-sectioning semiconductor devices. In ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis (pp. 592-596). Materials Park, OH: ASM International.
Failure analysis; flash memory; ion milling; top-down deprocessing; delayering Top-down delayering by low energy, broad-beam, argon ion milling – a solution for microelectronic device process control and failure analyses Nowakowski, P., Ray, M., Fischione, P., & Sagar, J. (2017). Top-down delayering by low energy, broad-beam, argon ion milling — a solution for microelectronic device process control and failure analyses. 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 95-101.
Broad ion beam (BIB) milling, delayering, spot milling, 300 mm wafer Advances in large-area microelectronic device deprocessing for physical failure analyses and quality control Nowakowski, P., Boccabella, M., Ray, M., and Fischione, P. (2018). Advances in large-area microelectronic device deprocessing for physical failure analyses and quality control. In ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis (pp. 520-524). Materials Park, OH: ASM International.
Mixed gas, chromia sulfidation, carburization, water vapor Use of microanalysis to better understand the high‑temperature corrosion behavior of chromium exposed to multi‑oxidant environments Soltanattar, S., Nowakowski, P., Bonifacio, C. S., Fischione, P., and Gleeson, B. (2018). Use of microanalysis to better understand the high-temperature corrosion behavior of chromium exposed to multi-oxidant environments. Oxidation of Metals, 91(1-2), 11-31. 

Model 1063 WaferMill™ ion beam delayering solution

Failure analysis; flash memory; ion milling; top-down; deprocessing; delayering Top-down delayering by low energy, broad-beam, argon ion milling - a solution for microelectronic device process control and failure analyses Nowakowski, P., Ray, M., Fischione, P., and Sagar, J. (2017). Top-down delayering by low energy, broad-beam, argon ion milling — a solution for microelectronic device process control and failure analyses. 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 95-101. 
Broad ion beam (BIB) milling, delayering, spot milling, 300 mm wafer Advances in large-area microelectronic device deprocessing for physical failure analyses and quality control Nowakowski, P., Boccabella, M., Ray, M., and Fischione, P. (2018). Advances in large-area microelectronic device deprocessing for physical failure analyses and quality control. In ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis (pp. 520-524). Materials Park, OH: ASM International.
Delayering, cross-section samples, broad ion beam milling Advanced tools and techniques for delayering and cross-sectioning semiconductor devices Nowakowski, P., Ray, M. L., and Fischione, P. E. (2017). Advanced tools and techniques for delayering and cross-sectioning semiconductor devices. In ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis (pp. 592-596). Materials Park, OH: ASM International.

Model 1070 NanoClean

Plasma cleaning, EELS, EDS Plasma cleaning and its applications for electron microscopy Isabell, T. C., Fischione, P. E., O'Keefe, C., Guruz, M. U., & Dravid, V. P. (1999). Plasma cleaning and Its applications for electron microscopy. Microscopy and Microanalysis, 5(2), 126-135.
Plasma cleaning, carbonaceous contamination, shield, TEM, carbon hydroxide, holey carbon films, EELS, HREM Plasma cleaning of carbonaceous samples using a shield Willems, B., Hamon, A., Schryvers, D., Robins, A., Matesa, J., & Fischione, P. (2003). Plasma cleaning of carbonaceous samples using a shield. Microscopy and Microanalysis, 9, 164-165.
Semiconductor, plasma cleaning, carbonaceous contamination, TEM, SEM, SEM holders Applications of plasma cleaning for electron microscopy of semiconducting materials Isabell, T. C., & Fischione, P. E. (1998). Applications of Plasma Cleaning for Electron Microscopy of Semiconducting Materials. MRS Proceedings.
Plasma cleaning, cryo-EM, blotting, TEM, holey carbon films Improving automation for cryo-EM specimen preparation Quispe, J., Banez, R., Carragher, B., & Potter, C. S. (2004). Improving Automation for Cryo-EM Specimen Preparation. Microscopy and Microanalysis.
Cryo, protein, hydrogen plasma Controlling protein adsorption on graphene for cryo-EM using low energy hydrogen plasmas Russo, C. J., & Passmore, L. A. (2014). Controlling protein adsorption on graphene for cryo-EM using lowenergy hydrogen plasmas. Nature Methods, 11, 649–652.

Model 1080 PicoMill® TEM Specimen Preparation System

Ex situ lift-out (EXLO), narrow-beam argon ion milling Narrow-beam argon ion milling of ex situ lift-out FIB specimens mounted on various carbon-supported grids Campin, M. J., Bonifacio, C. S., Nowakowski, P., Fischione, P. E., & Giannuzzi, L. A. (2018). Narrow-beam argon ion milling of ex situ lift-out FIB specimens mounted on various carbon-supported grids. In ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis (pp. 339-344). Materials Park, OH: ASM International.
Narrow argon ion beam, gallium-induced artifacts, amorphization Automated end-point detection and targeted Ar+ milling of advanced integrated circuit FIB TEM specimens Bonifacio, C. S., Nowakowski, P., Campin, M. J., Harbaugh, J. T., Boccabella, M., and Fischione, P. E. (2017). Automated end-point detection and targeted Ar+ milling of advanced integrated circuit FIB TEM specimens. In ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis (pp. 375-379). Materials Park, OH: ASM International.
FIB artifacts, finFET, TEM, HRTEM Low energy Ar ion milling of FIB TEM specimens from 14 nm and future finFET technologies Bonifacio, C. S., Nowakowski, P., Campin, M. J., Ray, M. L., & Fischione, P. E. (2018). Low energy Ar ion milling of FIB TEM specimens from 14 nm and future FinFET technologies. In ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis (pp. 241-246). Materials Park, OH: ASM International.

Model 2040 Dual-Axis Tomography Holder

TEM, tomography, tilt series The transformation of enterovirus replication structures: a three-dimensional study of single- and double-membrane compartments Limpens, R. W., Schaar, H. M., Kumar, D., Koster, A. J., Snijder, E. J., Kuppeveld, F. J., & Barcena, M. (2011). The transformation of enterovirus replication structures: a three-dimensional study of single- and double-membrane compartments. Mbio, 2(5).
HIV-1, tomography, tilt series Electron tomography of HIV-1 infection in gut-associated lymphoid tissue Ladinsky, M., Kieffer, C., Olson, G., Deruax, M., Vrbanac, V., Tager, A., Kwon, D., Bjorkman, P. (2014). Electron Tomography of HIV-1 Infection in Gut- Associated Lymphoid Tissue. PLoS Pathogens, 10(1).
Dual axis electron tomography, Z-contrast imaging, 3D Reducing the missing wedge: high-resolution dual axis tomography of inorganic materials Arslan, I., Tong, J. R., & Midgley, P. A. (2006). Reducing the missing wedge: high-resolution dual axis tomography of inorganic materials. Ultramicroscopy, 106, 994–1000.

Model 2050 On-Axis Rotation Tomography Holder

Spectral imaging, 3D, chemical imaging, EDS, tomography Computed tomographic spectral imaging: 3D STEM-EDS spectral imaging Kotula, P. G., Brewer, L. N., Michael, J. R., & Giannuzzi, L. A. (2007). Computed tomographic spectral imaging: 3D STEM-EDS spectral imaging. Microscopy and Microanalysis, 13, 1324-1325.
Porous materials, electron tomography, discrete tomography, quantitative, thin films Measuring porosity at the nanoscale by quantitative electron tomography Biermans, E., Molina, L., Batenburg, K. J., Bals, S., & Tendeloo, G. V. (2010). Measuring porosity at the nanoscale by quantitative electron tomography. Nano Letters, 10, 5014-5019.
Electron tomography, carbon nanotubes, missing wedge, FIB, TEM, patterned nanostructures, 3D Three-dimensional analysis of carbon nanotube networks in interconnects by electron tomography without missing wedge artifacts Ke, X., Bals, S., Cott, D., Hantschel, T., Bender, H., & Van Tendeloo, G. (2010). Three-dimensional analysis of carbon nanotube networks in interconnects by electron tomography without missing wedge artifacts. Microscopy and Microanalysis, 16, 210-217.
Coated conductors, thin films, HAADF-STEM, EELS, tomography Barrier efficiency of sponge-like La2Zr2O7 buffer layers for YBCO-coated conductors Molina, L., Tan, H., Biermans, E., Batenburg, K. J., Verbeeck, J., Bals, S., & Tendeloo, G. V. (2011). Barrier efficiency of sponge-like La2Zr2O7 buffer layers for YBCO-coated conductors. Superconductor Science & Technology, 24(6), 065019-065019.

Model 3000 Annular Dark Field Detector

Dual axis electron tomography, Z-contrast imaging, 3D Reducing the missing wedge: high-resolution dual axis tomography of inorganic materials Arslan, I., Tong, J. R., & Midgley, P. A. (2006). Reducing the missing wedge: high-resolution dual axis tomography of inorganic materials. Ultramicroscopy, 106, 994–1000.

NanoMill and PicoMill are registered trademarks of E.A. Fischione Instruments, Inc. WaferMill is a trademark of E.A. Fischione Instruments, Inc.