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  • Minimal mechanical and thermal damage
  • Thin specimens (>10 microns) or thick (<1 cm)
  • Specimen always parallel to cutting axis
  • Rapidly cuts disks, rods, or rectangular specimens
  • Alignment microscope
  • Automatic termination


Quickly cuts specimens from hard, brittle materials

The Model 170 Ultrasonic Disk Cutter rapidly cuts transmission electron microscopy (TEM) specimens from hard, brittle materials without mechanical or thermal damage. It directly produces disk specimens from materials as thin as 10 microns, cylindrical rods up to 10mm long from bulk samples, or rectangular wafers that are subsequently used in the preparation of cross-section TEM (XTEM) specimens.

Unique design
Its unique design means that the sample is always presented parallel to the cutting axis. An optional microscope facilitates site-specific cutting by helping to locate an area of interest in the bulk material. A dial indicator accurately displays the depth of the cutting tool. The process is automatically terminated once the specimen has been cut.

Optimized cutting
The Model 170 Ultrasonic Disk Cutter uses the excitation of lead zirconate titanate (PZT) crystals oscillating at a frequency of 26kHz to effect cutting tool movement. The cutting medium is an abrasive slurry of either boron nitride or silicon carbide. Tool motion is optimized to cut at the maximum rate while minimizing mechanical and thermal specimen damage.



Multiple individual sections of a microelectronic material
 

Download product literature for the Model 170 Ultrasonic Disk Cutter.

 

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