Large scale milling of planar and cross-section samples; creates the largest and most uniform flat area achievable by ion milling. Provides the ultimate workflow for environmentally sensitive materials.
A fully automated tabletop argon ion mill that features highly flexible milling parameter adjustment. The instrument offers large-scale milling of planar and cross-section samples.
Samples of up to 50 mm diameter are effectively processed with three ion sources, which creates the largest and most uniform flat area achievable by ion milling. Allows the direct transfer of environmentally sensitive materials to a SEM or FIB.
Bulk Mg ribbons were prepared using a broad Ar ion beam milling system for the removal of surface artifacts. The bulk sample was then transferred under a protected environment to a FIB system for imaging and EBSD analysis. FIB specimen preparation of the APT specimens followed by concentrated Ar ion beam milling...
We report on elastic strain measurements associated with the (y/y') interfaces in Ni-superalloy by HR-EBSD. We also present plastic strain measurements in titanium alloys and aluminum alloys by conventional EBSD. We report on the influence of two sample preparation methods in HR-EBSD strain mapping for crystalline...
A mechanism of cracking is proposed for pure magnesium, taking into account ASB formation and dynamic recrystallization. Under dynamic high-strain loading conditions, the geometrically necessary dislocation (GND) density increases within the grains. To accommodate the strain, the grains tend to rotate and GND...
Stainless steel was studied regarding its sensitivity to strain-induced structural changes. The microstructural changes caused by sample preparation techniques are revealed by EBSD analyses. A high-resolution EBSD strain measurement comparative study is presented of different sample preparation techniques...
Broad argon ion beam milling produces excellent surface quality over a millimeter-scale area.
We have performed a comparative study of different sample preparation protocols on the deformation structures introduced to aluminum samples by controlled uniaxial compression at room temperature to obtain plastic strains of 0, 4, 6, and 15%. As a quantitative metric for deformation, the geometrically necessary...
The detailed sample preparation of a solder joint at the level between a semiconductor package and board is presented; the goal was to target a large sample area that contains multiple solder bumps. The sample preparation method was confirmed by advanced structural characterization and strain measurement.
This work focuses on solder bump cross-section sample preparation and strain measurement. Two different sample techniques are described and compared: conventional MP using colloidal silica suspension and broad ion beam milling. Sample preparation is then confirmed by advanced structural characterizations and strain...
A tabletop argon ion mill that features highly flexible milling parameter adjustment. The instrument offers large-scale milling of planar and cross-section samples. Samples of up to 50 mm diameter are effectively processed with three ion sources, which creates the largest and most uniform flat area by ion milling.