Model 1061
SEM Mill
A state-of-the-art ion milling and polishing system. It is compact, precise, and consistently produces high-quality scanning electron microscopy samples in the shortest amount of time for a wide variety of applications.
Ion milling is used in the physical sciences to enhance the sample’s surface characteristics. Inert gas, typically argon, is ionized and then accelerated toward the sample surface. By means of momentum transfer, the impinging ions sputter material from the sample at a controlled rate.
For many of today’s advanced materials, analysis by scanning electron microscopy is an ideal technique for rapidly studying material structure and properties. The SEM Mill is an excellent tool for creating the sample surface characteristics needed for SEM imaging and analysis.
- Two independently adjustable TrueFocus ion sources
- High energy operation for rapid milling; low energy operation for sample polishing
- Ion source maintains its small beam diameter over a wide range of operating energies (100 eV to 10 keV)
- Faraday cups for the direct measurement of beam current from each ion source
- Adjustable 10-inch touch screen with a user-friendly interface for simple setup of milling parameters
- Create pristine cross-section samples with the Cross-section station (optional)
- Independent ion source gas control
- Adjustable milling angle range of 0 to +10°
- In situ viewing and image capture during milling
- Sample rocking or rotation with ion beam sequencing
- Automatic termination by time or temperature
- Liquid nitrogen-cooled sample stage (optional)
- Vacuum or inert gas transfer capsule (optional)
Solder bump joint sample preparation for failure analyses
Solder bump joint failure analyses of microelectronics devices are critical for ensuring device reliability. Argon broad ion beam milling is an ideal sample preparation technique because it does not introduce strain or structural changes to the sample and preserves the sample in its native state.