The Model 1064 ChipMill is a fully integrated solution for large-scale delayering – up to a 10 x 10 mm milling area – of both memory and logic semiconductor devices. Compared to all other methods, the ChipMill produces the flattest surface over the largest area. The ChipMill’s artificial intelligence automatically adjusts milling parameters to yield nanometer flatness within the prepared area.

The ChipMill reduces time and costs associated with research and development, manufacturing, quality assurance, and failure analysis by yielding unsurpassed results. As the demand for semiconductor devices grows, device sizes decrease, and architecture becomes more complex, the ability to perform controlled delayering during all phases of the product life cycle is essential.

• Nanometer flatness of the prepared area

• Milling area up to 10 x 10 mm

• Automated sample height detection

• User-friendly interface for the setup of milling parameters and display of images and analytical data

• On-device touchscreen for managing sample insertion and removal

• End-pointing by time, chip structure, or chemical composition

• Components:

  • Ion source

  • Optical camera

  • Electron beam column

  • Secondary electron detector (SED)

  • Backscattered electron (BSE) detector

  • Energy dispersive X-ray spectrometer (EDS)

  • Secondary ion mass spectrometer (SIMS)