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Model 170

Ultrasonic Disk Cutter

Conventional specimen preparation

Quickly cut transmission electron microscope specimens from hard, brittle materials without mechanical or thermal damage.

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Ultrasonic Disk Cutter

Ultrasonic disk cutting is a proven method for producing TEM planar or cross-section specimens. Creates disk, cylindrical, and rectangular specimens.

  • Disk specimens from materials as thin as 10 μm
  • Rods up to 10 mm long
  • Rectangular wafers for transmission electron microscopy cross-section specimens
  • Precise specimen positioning
  • Specimen is always parallel to the cutting axis
  • 10 μm resolution depth indicator
  • Automatic termination
  • Optional microscope attachment

Cutting disk specimens for transmission electron microscopy

Ultrasonic disk cutting is a method for producing transmission electron microscopy specimen disks from any hard, brittle material, such as ceramic, semiconductor, and geological materials. This technique produces either disk specimens from materials as thin as 40 µm or cylindrical rods up to 10 mm in length.

Silicon cross-section specimen preparation for transmission electron microscopy

Proper preparation of specimens improves the quality of the resulting transmission electron microscope images.

Silicon plan view specimen preparation for transmission electron microscopy

Proper preparation of samples for ion milling increases milling process speed and improves the quality of the resulting transmission electron microscope images.

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